Revolutionizing the EV Industry: Infineon and Foxconn Join Forces to Create Cutting-Edge Electric Vehicles
Infineon Technologies AG, a global leader in automotive semiconductors, has signed a Memorandum of Understanding (MoU) with Hon Hai Technology Group, also known as Foxconn, the world’s largest electronics manufacturing services provider, to develop advanced electric vehicle (EV) technology. The partnership will focus on the development of silicon carbide (SiC) technology, leveraging Infineon’s automotive SiC innovations and Foxconn’s automotive system know-how to create efficient and intelligent features.
The collaboration will involve the implementation of SiC technology in high-power automotive applications such as traction inverters, onboard chargers, and DC-DC converters. The two companies will work together to develop EV solutions with exceptional performance and efficiency based on Infineon’s automotive system understanding, technical support, and SiC product offerings, combined with Foxconn’s electronics design and manufacturing expertise and system-level integration capability.
The partnership also plans to establish a system application centre in Taiwan to expand the scope of their cooperation. The centre will optimize vehicle applications, including smart cabin applications, advanced driver assistance systems, and autonomous driving applications, as well as electromobility applications such as battery management systems and traction inverters. Infineon’s automotive products, including sensors, microcontrollers, power semiconductors, high-performance memories for specific applications, human-machine interface, and security solutions, will be covered by the collaboration.
“The automotive industry is evolving, and with the rapid growth of the EV market and the associated need for more range and performance, the development of electromobility must continue to advance and innovate,” said Peter Schiefer, President of the Infineon Automotive Division. “Infineon’s commitment and passion for innovation and zero-defect quality has made us the best partner for our customers. We look forward to writing a new chapter in electromobility together with Foxconn.”
“We are pleased to be working with Infineon and are confident that this collaboration will result in optimized architecture, product performance, cost competitiveness, and high system integration to provide customers with the most competitive automotive solutions,” said Jun Seki, Foxconn’s Chief Strategy Officer for EVs.
The system application center is expected to be established within 2023, and the partnership marks a significant step towards developing advanced EV technology that is efficient, intelligent, and cost-effective.
