Boards
STMicroelectronics Unveils STM32H5 Discovery Kit for Secure, Smart, and Connected Devices
STMicroelectronics, a global leader in semiconductor solutions, has introduced the STM32H573I-DK Discovery kit, a versatile development board that promises to accelerate the creation of secure, smart, and connected devices. This
TI simplifies current sensing with the industry’s most accurate Hall-effect sensors and integrated shunt solutions
• Lowest-drift isolated Hall-effect current sensor reduces design complexity in high-voltage systems• EZShunt™ integrated shunt portfolio simplifies designs while reducing system cost and maximizing performance Texas Instruments (TI), a frontrunner
Explore the world of nRF Connect SDK Fundamentals for Electronic Engineers
The rapid development of electronic devices has revolutionized the way we live our lives, from the way we communicate to the way we control our environment. With the right development
Exploring the dsPIC33CK64MC105 Curiosity Nano Evaluation Kit
Technology is evolving at a rapid pace, and electronic engineers must keep up to date with the latest innovations. One of the latest products in the microcontroller world is the
STMicroelectronics launches multi-connectivity development kit for indoor and outdoor asset tracking
The STEVAL-ASTRA1B multi-connectivity evaluation platform from STMicroelectronics provides a complete ecosystem for building a complete proof-of-concept for asset tracking systems. Battery-powered, and with a small form factor, the evaluation kit also includes
ARM announces support for Morello evaluation board
January 20, 2022 News Highlights: Morello program, a collaboration between Arm, University of Cambridge, and other industry leaders hits new milestone in defining next generation security Prototype architecture now available
STM’s First Reference Design for MasterGaN
MasterGaN Reference Design from STMicroelectronics Demonstrates Heatsink-Free 250W Resonant Converter STMicroelectronics has released the first reference design for its MasterGaN power packages, demonstrating how the new highly integrated devices increase
Toshiba and Nordic Semi team-up to launch the World’s Smallest BLE Module
Nordic Semiconductor today announces that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy
Versatile Single-Board Kit for Wireless Application from Nordic-nRF52840 DK
Bluetooth Low Energy, Bluetooth mesh, NFC, Thread and Zigbee development kit for the nRF52840 SoC The nRF52840 DK is a versatile single-board development kit for Bluetooth Low Energy, Bluetooth mesh,
STMicroelectronics Introduces STM32L4+ Microcontrollers: Power- and Cost-Sensitive Smart Embedded Applications
Electronics are becoming more and more competitive in terms of power consumption, form factor, security, and pricing. Finding a sweet spot in these 4 domains is a challenge for most
