Accelerometer and Gyroscope SiP IC with Built-In Machine Learning

Accelerometer and Gyroscope SiP IC with Built-In Machine Learning
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The LSM6DSOX, is STM’s latest released Acceleration and orientation (gyroscope) Sensor IC with capabilities to process the data via machine learning techniques without any external microcontrollers inputs.

Dividing processing power amongst various electronic active elements helps in reducing computation time and power of the device, and enables easier data processing as well as increasing performance. Instead of the main controller and processor performing all the number crunching and algorithmic processing, semi processed or pre processed data is provided as input to the controller. Attached sensors, peripherals and DSPs aim to process their own data hence reducing power consumption of the main processor/controller and time for processing wherever possible. The LSM6DSOX, ST’s latest inertial module that has machine learning capabilities.

The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DSOX supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

Machine Learning Core

 

The LSM6DSOX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

The LSM6DSOX fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DSOX OIS can be configured from the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).

High robustness to mechanical shock makes the LSM6DSOX the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOX is available in a plastic land grid array (LGA) package.

Sensor Connection Mode

Key Features

  • Power consumption: 0.55 mA in combo high-performance mode
  • “Always-on” experience with low power consumption for both accelerometer and gyroscope
  • Smart FIFO up to 9 kbyte
  • Android compliant
  • ±2/±4/±8/±16 g full scale
  • ±125/±250/±500/±1000/±2000 dps full scale
  • Analog supply voltage: 1.71 V to 3.6 V
  • Independent IO supply (1.62 V)
  • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
  • SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization 
  • Auxiliary SPI for OIS data output for gyroscope and accelerometer
  • OIS configurable from Aux SPI, primary interface (SPI / I²C & MIPI I3CSM)
  • Advanced pedometer, step detector and step counter
  • Significant Motion Detection, Tilt detection
  • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
  • Programmable finite state machine: accelerometer, gyroscope and external sensors
  • Machine Learning Core
  • S4S data synchronization
  • Embedded temperature sensor
  • ECOPACK®, RoHS and “Green” compliant 

 

Applications

    • Motion tracking and gesture detection
    • Sensorhub
    • Indoor navigation
    • IoT and connected devices
    • Smart power saving for handheld devices
    • EIS and OIS for camera applications
    • Vibration monitoring and compensation

Datasheet available here

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